Global Industry Analysis of Underfill Market 2024

Underfill materials are composite formulations of organic polymers and inorganic fillers which are used in semiconductor packaging to achieve improved thermo mechanical performance. Polymer adhesives are used as underfill material to distribute mechanical stresses at solder joint which occurs due to difference in the thermal expansion coefficients at the interconnect. Various phenolic and amine based epoxy materials are used as underfill material in semiconductor packaging industry. High thermal stability and reworkability are desired characteristics for underfill material in the semiconductor packaging industry. They are used in various packaging techniques such as flip chip, ball grid array (BGA), and chip scale packaging (CSP), etc.

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Flip chip is a major application for underfill material. Global flip chip market is showing strong demand and is estimated to witness double digit growth in near future. The ever growing demand for lighter, smaller, efficient yet cost effective devices has drawn remarkable attention towards the underfill material. Capillary underfill (CUF), no flow underfill (NUF), and molded underfill (MUF) techniques are used for the application of underfill materials. Due to growing pricing pressure from end use industry, CUF being a conventional and relatively costly technique is replaced by MUF process technique.

Global Underfill Materials Market Dynamics

Recently, the microelectronic industry is governed by more complex devices, due to trending system on chip (SOC) and system in package (SIP). The trends in portable end use market are driving the global underfill material market growth. The growing demand for low cost, high performing, small in size devices is one of the major driving factors for global underfill material market growth.   The increasing use of underfill material from flip chip packaging and wafer level packaging due growing...