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Flip Chip Technology Market - Global Industry Analysis, Growth, Trend, Forecast 2024

  • Date Submitted: 10/10/2016 12:57 AM
  • Flesch-Kincaid Score: 34 
  • Words: 578
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The flip chip technology   market is presently experiencing a high growth due to the advancement in copper pillar and micro bumping metallurgy and its extended use in consumer electronics products and mobile phones. The most advanced packaging technologies are being served by new bumping solutions thus in turn flip chip technology is able to adapt to meet new challenges. Because of its increased performance capabilities flip chip technology has become a widely accepted technology in mid-range and high-range applications. Increasing demand for mobile-wireless, computing and consumer applications is driving the market for the flip chip technology market.

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To obtain the integration   of diverse chips 2.5D IC packaging technology and 3D IC packaging technology are becoming the typical trend these days. Consumer electronics market holds the largest market share for flip chip technology market and it is expected to grow at highest rate. Flip chip technology market is further driven by its application in automotive market and it is expected to grow at higher CAGR rate. Demand for raw materials has been significantly increased by the manufacturers producing new technologies for bumping process. This leads to the aggressive growth in this business among the raw material market players.

Based on the Wafer Bumping Process the flip chip technology market is segmented into:

Copper (Cu) pillar
Lead-free
Tin/lead eutectic solder
Gold stud+ plated solder

Based on the Packaging Technology the flip chip technology market is segmented into:

2D IC
2.5D IC
3D IC

Based on the Packaging Type the flip chip technology market is segmented into:

FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP

Based on the Product the flip chip technology market is segmented into:

Memory
LED
CMOS Image sensor
RF, analog, mixed signal, and power IC
CPU
SoC
GPU

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